Accelerating semiconductor innovation from idea to volume
On 11 November, Sioux Technologies will be at the APC-FMF Expo during SEMICON Europa 2026 in Munich.
For semiconductor equipment, performance depends on many disciplines working together. That is why we combine our expertise in software, mathware, electronics, mechatronics, optics, and assembly to develop and build complex systems from concept through to series production.
What to expect
At our booth (#4), we will show how our Sioux building blocks support semiconductor innovation across:
Applied AI & Mathware: Physics-informed machine learning, set-point optimization, and computational imaging.
Precision positioning: Sioux real-time full-system control, ultra-fast XYZ positioning, and optimization for maximum throughput.
Inspection & analysis: Pre-bond wafer and die inspection, nanometre-level alignment, and post-bond inspection using technologies such as IR, X-ray, and e-beam.
System control & application: Fab integration support, real-time system control, and brownfield optimization.
Prototyping & series production: Fast prototyping, build-to-print, and supply chain optimization.
From prototypes and modules to complete systems
We help turn complex semiconductor technology into solutions that work in practice and can scale towards volume production.
11 November
Messe München, ICM - Booth #4
Meet our team in Munich
Discover how Sioux can help accelerate your next semiconductor development.
For more information and tickets: www.semiconeuropa.org/about/register