Extreme Opitcal Positioning
Semiconductor Nano-Aligner
Nanometer optical accuracy for wafer and die alignment
BRING EXTREME-ACCURATE ALIGNMENT TO LIFE IN WAFER & ADVANCED PACKAGING
CUSTOM INTEGRATION
Customization to ensure resilient integration in customer system.FULL LIFECYCLE SOLUTIONS
From architecture to production at scale.50+ YEARS IN HIGH-TECH SYSTEMS
Working for leading companies in semiconductors, medical & analytical.
THE ALIGNMENT CHALLENGE
Nanometer overlay measurements
Reaching nanometer-level alignment is no longer a matter of combining accurate components — it requires the full optical, mechanical, thermal and control chain to be balanced together.
Shrinking (optical) budgets
Take a typical ±250 nm alignment target: once device-under-test characteristics, mechanical tolerances, component variation, and thermal & airflow effects are all accounted for, as little as ±50 nm of optical budget remains to work with.
Extreme positioning integral part of system performance
Reaching nanometer performance combined with high system throughput requires a resilient operation of you optical alignment module combined with an extreme position stage/chuck. Sioux SIPS platform for stages combined with our SAXCS real time control system enables such high accuracy combined with high throughput.
Fast innovation to the market
Advanced packaging roadmap requires a continious innovation in optical inspection and alignment. Sioux expertise and building blocks is a quick start to ensure fast time-2-market
Key features
Sub-50 nm alignment accuracy
Optical measurement accuracy down to ±10 nm (3σ), enabling system-level wafer/die alignment as tight as ±50 nm.
Thermal stability
An athermal opto-mechanical design holds performance stable to within ±1°C, keeping the optical budget locked across the operating range.
High-speed
Fast measurement-to-motion feedback keeps up with high-throughput handling, without trading away precision.
Compact form factor
A small envelope makes the module easy to embed close to the process, without disturbing existing tool architecture.
Seamless integration
Designed to drop into your bonder, stage, markers and throughput — and to integrate with Sioux or third-party hardware and software.
Custom engineering, Commercial Off-the-Shelf (COTS) where possible
Working distance, field of view, wavelength and marker specification are tailored to the application — custom optics, mechanics and software where needed.WHAT IS YOUR CHALLENGE?
Share your challenge with us, and we'll help bring your high-tech solution to life.
Contact us